Learn how to enhance the modeling of heat dissipation from copper trace and connections in electronics thermal management simulations. 

Often in 3D thermal simulations, all power is considered dissipated in semiconductor components within the system. However, in systems incorporating power modules, up to 30 percent of power dissipated may be dissipated in trace and mounting connections so thermal influences should be considered. This whitepaper details how to achieve higher accuracy in modeling these influences using test and simulation.

  • Power dissipation impact and electro-thermal modeling approaches
  • Using thermal measurement (Simcenter T3STER) and simulation (Simcenter Flotherm) for accuracy
  • An IGBT module 3D based example and further circuit modeling considerations